Eutectic Die Bonder
The Palomar Technologies Model 6500 Precision Eutectic Die Bonder provides a high accuracy, high-throughput solution for hybrid assembly. With a footprint of only 38 x 48″, the 6500 takes up less than half of the cleanroom space of comparable equipment. A 6 x 12″ work area eliminates the need for additional bond heads to feed and preposition die in the work area. The 6500 moves quickly using high-speed linear motors on an air-bearing table. The rigidity and speed of this positioning system enable post-process accuracy of better than 1.5 &#181m at 3 sigma at cycle times of less than seven seconds per pick/place operation. A 6-position, bidirectional tool turret maximizes flexibility and throughput by changing pick tools “on the fly” rather than using a tool docking/ undocking system. The 6500 uses Palomar’s award-winning pulse heat control system with rapid heating rates of more than 100&#176C per second, with control within 2&#176C through the entire eutectic cycle. For maximum flexibility, the 6500 allows die presentation from wafer die feeders, waffle packs, gel packs and automated waffle pack loaders.
Palomar Technologies

Semiconductor Companies Take Center Stage at Advanced Packaging Award Program
SAN JOSE, CALIF.
On Wednesday, July 16, Advanced Packaging magazine honored top supplier companies and their staffs with the 2003 Advanced Packaging Awards at a ceremony held here at the McEnery Convention Center.