JULY 11–SAN JOSE, Calif.–KLA-Tencor Corp. has unveiled AccuFilm, a technology that eliminates the effects of airborne molecular contamination (AMC) on ultra-thin-film measurements.

The technology was designed for KLA’s SpectraFx 100 optical thin-film measurement system. A drawback to achieving control on advanced gate processes below the 0.10-micron node, where gate dielectric films can be less than 20 Angstroms thick, AMC can grow rapidly on film surfaces, minimizing accuracy and repeatability of gate dielectric metrology.

According to the company, AccuFilm enables SpectraFx 100 to remove these contaminants from product wafers in mere seconds before taking film measurements without effecting yield. In addition to providing in-situ
AMC control, AccuFilm includes a self-calibrating measurement sub-system to the SpectraFx 100.

“KLA-Tencor’s new AccuFilm option enables us to accurately measure the true thickness and non-uniformity of very thin gate dielectrics,” says Eric Trumbauer, yield enhancement section manager at Texas Instruments’ DMOS6 fab, said in a statement. “This technology can significantly improve process control of advanced gates.”

AccuFilm eliminates measurement artifacts caused by AMC without damaging surface and sub-surface layers, according to KLA. It accomplishes this at the measurement site within the scribe line of product wafers with a measurement spot size or 40 microns by 40 microns.

Only a few seconds are needed to clean the site before film measurements can be taken. AccuFilm also provides the tool to tool and fab to fab matching capability within 0.2 Angstroms required for high-volume manufacturing environments, the company claimed. The technology is now available as an upgrade for KLA-Tencor’s SpectraFx 100 and ASET F5x systems.