July 3, 2003 – UMC, Hsinchu, Taiwan, and High Bandwidth Access Inc. (HBA), a developer of memory devices, have successfully prototyped HBA’s high-speed IC based on the foundry’s 90nm process. Volume production is expected later this year.
The 90nm design will greatly increase HBA’s revenues from SRAM sales to the billion-dollar telecom and data communications market, said HBA chairman and CEO Steven Huang.