Web broadcast to highlight impact of IC interconnects

Dr. Kenneth A. Monnig, interconnects program associate director, International SEMATECH, will give the keynote presentation of the 3rd Annual Surface Conditioning Process Symposium, held July 9-11, 2003, in Chaska, MN. Dr. Monnig’s talk on the impact of challenges in IC interconnects on the semiconductor industry will be broadcast live on the Web via the Process Outlook Forum, a monthly seminar series jointly sponsored by FSI International, Chaska, MN, and Solid State Technology magazine, Nashua, NH.

Registered users may participate live through a teleconference, or may access the presentation archive later at anytime to download the presentation and audio recording in MP3. Registration for the Forum is free at www.fsi-intl.com/forum.

The Process Outlook Forum, launched in March, 2003, provides value to engineers, researchers, and others in the semiconductor industry by addressing various issues pertaining to IC process technology challenges, from process tool development to the future of IC manufacturing.

The Surface Conditioning Process Symposium is held annually to share and exchange process data and system information between the engineering communities of FSI and its customers and downstream suppliers, including materials suppliers and industry consortia. Attendees will discuss new applications, capabilities and products; identify issues and problems; and provide input into the FSI Technology Roadmap and strategic planning process. The meeting is non-confidential, but is restricted to FSI’s customers, partners and affiliates.

This year’s symposium topics will address surface conditioning issues related to the implementation of high-k and copper/low-k, the development of 90nm solutions, such as megasonics-free and etch-free critical clean, and cleaning for specialty markets, such as MEMS.


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