ChipMOS, Renesas sign test deal

August 11, 2003 – ChipMOS Technologies has signed an agreement to provide wafer testing and IC assembly and testing services to Renesas, Hsinchu, Taiwan. The deal, which expands the company’s reach in Japan, covers Renesas’ mobile memory chips for use in handheld devices, and low-power memory chips for graphics applications. The qualification for ChipMOS took over half a year.


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