Cree, APT sign die pact

August 5, 2003 – Advanced Power Technology, Bend, OR, has signed a deal to repackage and sell the SiC Zero Recovery Schottky diode die from Cree Inc., Durham, NC. APT will add its MOSFETs and IGBTs to the diodes in various combinations, including boost and buck configurations and power modules. Volume production is slated for 4Q03.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.