August 5, 2005 – Polymer Assembly Technology, Billerica, MA, has opened up shop to offer flip-chip technology using polymer conductive adhesives. Founder and president Jim Clayton is the former director of R&D at Polymer Flip Chip Corp.
The new company is currently working to combine adhesive-bumped sensor devices with gold stud bumped VLSI chips, and is working with private and government labs to develop X-ray detectors and IR focal plane arrays.