Ball, Wedge Bonders
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Model 5060 Automatic Ball Bonder and Model 5070 Automatic Wedge Bonder reportedly offer large area, deep access, ball and wedge wire bonding for microelectronics packaging applications. The bonders feature a 25 percent smaller footprint than other systems in the company's platform as well as a 12 x 5″ work area. Designed for ergonomic operation, the on-screen, menu-driven interface reportedly simplifies operator training, allowing for a short path to automated production. The ball bonder provides thermosonic ball and stitch bonding with a heated workstage and an optional capillary heater. The wedge bonder provides ultrasonic or thermosonic wedge bonding with a heated workstage, and is capable of bonding with round wire or gold or aluminum ribbon. Palomar Technologies, Vista, Calif., www.palomartechnologies.com.
Acoustic System-on-Chip
An acoustic system-on-chip (SoC), Microphone Chips and Speaker Chips are said to be based on MEMS technology that integrates the functionality of multiple microphones or speakers with microelectronics and software onto a single, standard CMOS semiconductor chip. The analog microphone chip has an array of 64 membranes and an on-chip analog amplifier. It measures 3.0 x 3.65 x 0.5 mm and offers performance reportedly on par with standard electret condenser microphones. Other advantages include integrated electronics, improved performance and design, manufacturing efficiency, and standard CMOS fabrication. Akustica Inc., Pittsburgh, Pa., www.akustica.com.
BGA Socket
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For use in test and development applications, the Matrix Series BGA Socket using MPI polymer material uses a compression contact technology to eliminate any electrical disturbance that traditional contacts can cause. The interconnect validates package or system performance without directly soldering the BGA to ..the board. A flexible manufacturing process allows for many socket configurations to be produced without tooling charges. Sockets are available in standard pitches of 1.27, 1.00 and 0.80 mm. Standard socket configurations reportedly are fully populated arrays with sizes from 10 x 10 to 60 x 60, yielding up to 3,600 contacts in a single array. Tyco Electronics, Harrisburg, Pa., www.tycoelectronics.com.
X-ray Inspection System
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X8011 series X-ray inspection system features automatic handling for inline capability and a larger inspection area in a compact footprint. Axis manipulation, a VMC user interface and ..comprehensive analysis software ensure improved performance and ease of use. The system offers a 360 x 410 mm inspection area in a minimal footprint, allowing inspection of larger assemblies or other objects with a maximum weight up to 10 kg. In addition to a three-axis manipulator, a motor-driven, tilting unit is used for 3-D inspection. A tilting circuit board holder designed for flat assemblies is also available. Viscom USA, Norcross, Ga., www.viscomusa.com.
Socket Building Software
Socket Builder is a step-by-step program that customizes test socket designs. This Web tool generates a socket drawing in minutes, accelerating delivery by as much as two weeks. By going to www.socketbuilder.com or www.synergetix.com, customers design their own socket on the Web. Based on input, the software generates an engineering drawing for the socket in a detailed manufacturing drawing. Synergetix, Kansas City, Kan.
