Amkor, Triquint join for flip-chip

September 9, 2003 – Triquint Semiconductor, Hillsboro, Oregon, and Amkor Technology, Chandler, AZ, are collaborating on a low-cost low-cost flip-chip assembly process for gallium arsenide (GaAs) semiconductors.

The technology utilizes Triquint’s CuFlip copper bumping technology to link contact points to the substrate. The process has led to a 40% reduction in size for Triquint’s 6x6mm 7M4009 GSM power amplifier module.


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