August 28, 2003 – Intel Corp., Santa Clara, CA, says it will invest $375 million to build a chip assembly and testing facility in China’s western Sichuan province. Construction on the plant in Chengdu is expected to begin in early 2004, with operations beginning in late 2005.
Intel will invest $200 million up front in the facility, with an additional $175 million coming in a later round of funding. Intel already has a test facility in Shanghai, which it is planning to expand.