SEPT. 23–RIMINI, Italy– Multiplex Inc., a South Plainfield, N.J.-based manufacturer of optoelectronic components and integrated subsystems, is now offering custom compound semiconductor foundry services.
From a newly completed 10,000-square-foot facility, housing ISO Class 6 and ISO Class 7 cleanrooms, Multiplex is offering front-end capabilities for III-V semiconductor expitaxial growth, processing device design, testing, reliability qualification and failure mode analyses.
“With the facilities to more than adequately handle these complex processes, this was a logical step for Multiplex,” Won T. Tsang, Multiplex’s president and CEO, said from the European Conference on Optical Comminication. “We have had a successful run of high-end finished products, and I am confident that opening up our facilities to the industry will prove to be equally successful.”
The company also maintains a MOCVD epitaxy platform that includes Aixtron 2400 and 2000 multi-wafer reactors, and all GaAs- and InP-based material systems are supported.
Available epitaxial services include 980, 1310 and 1550 nm laser platforms (FP, DFB, etc.) and other custom structures and wavelengths; PIN and APD wafers optimised for 2.5 Gbit/s (and below) and 10 Gbit/s receiver applications; and custom photosensor and imaging wafers and chips for 1.2 to 1.65 micron applications. Other available foundry services include materials characterization, processing services and device design, testing and qualification.