September 5, 2003 – Nanometrics, Milpitas, CA, has introduced a pair of integrated metrology tools combining optical critical dimension spectroscopic ellipsometry with deep UV spectroscopic reflectometry.
The NanoOCD/DUV 9010 incorporates ultraviolet optical critical dimension (OCD) spectroscopic ellipsometry and deep ultraviolet spectroscopic reflectrometry to measure thin-film and film stack thickness on pads, as well as oxide, nitride, and trench profile measurements on single-tool arrays. The company claims the tool achieves throughput of greater than 200 wafer/hour, and meets all metrology requirements for dielectric CMP processes as well as SEMI interface standards.
Nanometrics also says that it has added OCD metrology capabilities to its 9300 line of advanced metrology systems, to eliminate the need for measuring film properties on separate tools. The company claims the dual-function tool achieves throughput of greater than 150 wafer/hour. Initial shipments of the 9300 system are scheduled for 3Q03.