August 28, 2003 – NEC Electronics Corp. is looking to nearly double the amount of chip assembly and test services it outsources from 15% to as much as 30%, according to the Nikkei Business Daily. NEC plans to continue to work in-house on more advanced chip packaging, while looking to farm out latter-stage processing work for commodity-grade chips. NEC currently has 10 domestic and foreign outsourcing partners, and may look to find new ones.