For suppliers of compound semiconductors in particular, the end of the bust cycle is critical. A study recently released by Kline & Co., an international business consulting firm, predicts that the light at the end of the tunnel is now in sight, even if the tunnel exit still looks far away.
(October 31, 2003) Chandler, Ariz.—Amkor Technology Inc. recently completed qualification of two IC packaging solutions at its J1 factory in Kitakami, Iwate-Prefecture, Japan. The company’s ‘Stacked Chip Scale Package’ combines thin-core substrates, silicon wafer thinning and film die attach. Its ‘Very Thin ChipArray Ball Grid Array’ is a chip scale package that consists of a thin-core, two-metal-layer, rigid laminate substrate and a thin molded cap.