Rudolph unveils automated metrology tool

October 17, 2003 – Rudolph Technologies, Flanders, NJ, has introduced a wafer-bow/stress metrology tool for measuring stress that develops during thin film deposition.

The ultra-WB uses multiple parallel laser beams rather than vibration techniques to measure the radius of wafer bow on unpatterned wafers.

The tool is build on the company’s Vanguard automation platform, and can be optionally equipped with FOUPs or SMIFs and 200mm or 300mm automation software.


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