SMIC hitches with Ellipsiz

September 25, 2003 – China’s Semiconductor Manufacturing International Inc. (SMIC) has signed a deal with MicroFab Technology, a subsidiary of Singapore design and packaging services specialist Ellipsiz Group, to profide wafer bumping solutions.

MicroFab will install and integrate a wafer bumping line as well as technical assistance and training. MicroFab also will grant a 10-year license to SMIC, as well as purchase up to $5 million worth of equipment, according to the Xinhua Financial News.


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