TI unveils new packaging

October 8, 2003 – Texas Instruments, Dallas, TX, has delivered analog components utilizing its NanoStart wafer chip-scale packaging technology. The NanoStar foundation uses standard SMT procedures but has no molding, lead frame, wire bonds or leads.

The first chips using the technology are a 200mA RF regulator and DC/DC buck converter, low-power linear voltage regulators, dual operational amplifier, an audio power amplifier, and a digital-to-analog converter.


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