October 10, 2003 – Atomnics Laboratory Inc. has developed new technology aimed at increasing chip mount density onto printed boards.
The Nikkei Business Daily reports that the company has created a method to use electroless plating to form pyramid-shaped metal bumps on the electrodes, thereby reducing the space between wires to less than 20 microns. An additive is mixed with the plating liquid to promote bump growth, while another method controls the direction of ions in the liquid.
One promising application is in TFT-LCD manufacturing, where the skinnier bumps could increase LCD monitor resolution by a factor of four. The company plans to further develop the two procedures, and then transfer the technology to metal-plating firms.