ASAT, Amkor ink patent agreement

Both companies hold numerous patents related to the JEDEC standard QFN packaging, and they have agreed to cross-license their related package design and manufacturing process technology patents. The agreement includes both currently issued patents held by either company, as well as future QFN patents granted to either party during the term of the license.

(November 17, 2003) Marlborough, Mass.&#8212Shipley Co. and Rodel will become Rohm and Haas Electronic Materials, effective February 1, 2004. Together, Shipley and Rodel comprise the more than $1 billion electronic materials business group of Rohm and Haas Co., which provides material solutions to the electronic and optoelectronic industries.


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