ChipPac takes six stacked-die CSP to market

According to ChipPAC market data, 100 percent of cell phones in 2004 will ship with stacked-die packages, up from an estimated 60 percent in 2003. Growth in stack packages will be compounded based on a forecasted 480 million handset sales in 2004, vs. the estimated 440 million in 2003. ChipPAC has developed products that can stack two to six die in a single package, irrespective of die size, die thickness, pin count or bond pad location and with passives needed by high-performance DSPs and ASICs to meet different price points in these consumer markets.

(November 12, 2003) Berlin, Germany&#8212Research conducted by an international team of micro- and nano- technology experts known as ‘enablingMNT,’ on MST/MEMS Equipment Manufacturers shows a strong position for German companies involved in this market, while most of their U.S. counterparts are based in California.


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