Nov. 18, 2003 — EV Group, an Austrian maker of MEMS and semiconductor wafer processing equipment, has been selected by DALSA Semiconductor to supply MEMS production equipment, according to a news release.
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EVG will first provide DALSA with custom versions of its Gemini Wafer Bonder Cluster tool and Hercules Thick Polymer Lithography tool, both seen as necessary to move MEMS into high-volume manufacturing. The equipment is expected to be ready for its first runs at DALSA’s Quebec facility within six months, the release said.