EV Group supplies equipment to DALSA

Nov. 18, 2003 — EV Group, an Austrian maker of MEMS and semiconductor wafer processing equipment, has been selected by DALSA Semiconductor to supply MEMS production equipment, according to a news release.


EVG will first provide DALSA with custom versions of its Gemini Wafer Bonder Cluster tool and Hercules Thick Polymer Lithography tool, both seen as necessary to move MEMS into high-volume manufacturing. The equipment is expected to be ready for its first runs at DALSA’s Quebec facility within six months, the release said.


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