EV, SiGen ink wafer bonding deal

November 3, 2003 – EV Group, Scharding, Austria, and Silicon Genesis Corp. (SiGen), San Jose, CA, have signed an agreement to develop low-temperature wafer bonding technologies.

Under the licensing deal, SiGen will transfer equipment and processes to EV for inclusion in EV’s line of wafer bonding tools. The combined technologies will provide high-throughput, low-temperature activated plasma bonding for EV’s wafer bonding system and cluster platforms.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.