Shipley Co. and Rodel to become ‘Rohm and Haas Electronic Materials’

Shipley Co. recently expanded its product range for wafer scale packaging and bump plating materials. The product line expansion includes photoimageable dielectrics for wafer level redistribution, electroplating photoresists and new metallization processes for IC interconnection.

(November 17, 2003) Irving, Texas&#8212Elcoteq Network Corp., a European electronics manufacturing services company, and Tellabs International signed an agreement whereby Tellabs will outsource manufacturing of its international products and transfer ownership of its Espoo, Finland manufacturing operations to Elcoteq.


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