ASE’s QFN packaging solution selected for advanced automotive functions

(December 17, 2003) Taipei, Taiwan&#8212Advanced Semiconductor Engineering Inc. (ASE), a semiconductor packaging and testing company, announced that international semiconductor supplier austriamicrosystems’ new low-power radio transmitter/receiver ASIC has been packaged using ASE’s quad flat no lead (QFN) solution.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.