ChipMos granted NT$2 billion in loans for capacity expansion

(December 31, 2003) Hsinchu, Taiwan&#8212ChipMOS Technologies Inc., an IC packaging and testing company, has signed syndicated loan agreements with five Taiwanese banks worth NT$2 billion to purchase equipment to expand its assembly and testing capacity.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.