ChipPAC expects 120% growth in 2004

(December 16, 2003) Fremont, Calif. &#8212 ChipPAC Inc., a provider of assembly and test services, announced that it expects continued, significant growth in the stacked-die packaging market share over the next several years. ChipPAC estimates that it already has a 65 percent market share for 3+ stacked-die packages, which shipped in approximately 10 percent of cell phones in 2003.


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