Fujitsu technology increases connection density

(December 15, 2003) Tokyo, Japan&#8212 Fujitsu Ltd. has developed technology that enables the formation of ultrafine-pitch 35-micron solder bumps, and high-precision flip chip bonding interconnection&#8212increasing connection density approximately 50 times compared to conventional flip chip interconnections. The technology actualizes downsizing of LSIs and LSI packaging, according to Fujitsu.


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