IBM to reveal self-assembly secret

Dec. 8, 2003 — IBM researchers have used a molecular self-assembly technique that could help boost a chip’s performance while shrinking its size, according to a news release.

The technique, which IBM said avoids the costs and risks of tooling and process changes, leads to polymer molecules forming more precise and uniform device features than those achieved using conventional lithographic methods. Researchers say such techniques could be used in pilot production within five years to make more powerful microprocessors for computers, communications devices and consumer electronics.

Researchers used self-assembly to form features of a memory device. The polymer patterns the formation of a dense silicon nanocrystal array. The processing was performed on wafers using methods fully compatible with existing chip-making tools, the release said.

IBM will present the findings Tuesday at the IEEE International Electron Devices Meeting in Washington, D.C.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.