PANalytical reveals wafer analysis progress

December 16, 2003 – PANalytical, Almelo, The Netherlands, a supplier of analytical devices for x-ray diffraction and x-ray fluorescence (XRF) spectrometry, says it has found a way to double the detection capability of XRF wafer analysis of boron concentrations for thin-film semiconductor wafers, reducing the counting time by a factor of four.

The work is notable for manufacturers of dielectric materials and films used in MRAM and GMR devices. XRF provides both film thickness and chemical composition of thin films, vs. optical metrology techniques which only provide thickness results.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.