January 22, 2004 -Amkor Technology, Chandler AZ, a provider of contract semiconductor assembly and test services, said it plans to “aggressively” expand its capacity for stacked chip-scale packages this year.
The company says customers that qualified logic plus memory products in late 2003 are beginning ramping up to production. Qualification builds for 3+ chip stacks have been completed for several customers.
Amkor is installing the additional capacity at its facilities in Taiwan and China, in addition to capabilities already online in Korea and Japan. It expects to ship stacked chip-scale packages at a rate of about 50 million/quarter by mid-2004, matching its production total for all of 2003.
The company produced nearly four million 3+ chip stacks in 4Q03 alone, up from just 20,000 in 1Q03; that number accounted for more than 20% of total stacked chip-scale production, with nearly 90% of the packages targeted for use in cell phones.