Amkor reports surge in demand, plans capacity expansion

(January 23, 2004) Chandler, Ariz.&#8212 Amkor Technology Inc., citing an accelerating demand for advanced packaging solutions for cell phones and other handheld applications, is aggressively expanding capacity for stacked chip-scale packages (S-CSPs). Amkor’s factories in Korea and Japan already produce stacked packages. The company will install S-CSP capacity in its factories in Taiwan and China early in 2004.

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