Amkor reports surge in demand, plans capacity expansion

(January 23, 2004) Chandler, Ariz.&#8212 Amkor Technology Inc., citing an accelerating demand for advanced packaging solutions for cell phones and other handheld applications, is aggressively expanding capacity for stacked chip-scale packages (S-CSPs). Amkor’s factories in Korea and Japan already produce stacked packages. The company will install S-CSP capacity in its factories in Taiwan and China early in 2004.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.