Hitachi units tie up for chip inspection

January 16, 2004 – Hitachi High-Technologies Corp. and Hitachi Electronics Engineering Co. are planning to restructure production of semiconductor inspection systems in 2004, according to the Asia Pulse newswire.

The companies have independently developed systems using their respective expertise in electronic and optical inspection, but now plan to cut costs by consolidating production functions such as using common materials, sharing facilities, and bulk purchasing.

Systems evaluation will be consolidated to the high-technology division’s plant in Naka, while production will be centered at the electronics division’s Saitama facilities by 2005.

The electronics division is scheduled to become a wholly-owned subsidiary of the high-technologies unit in 1H04.


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