IBM nabs VIA chip contract

January 6, 2004 – IBM has been chosen to manufacture chips using 90nm process technologies for VIA Technologies Inc., which had been a customer of TSMC. VIA noted IBM’s experience with silicon-on-insulator technology at its 300mm facilities in East Fishkill, NY. Production is scheduled to begin in 2H04. It’s the second high-profile steal for IBM; last year they won business from Nvidia, then TSMC’s largest client.


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