JAN. 14–BOISE, Idaho–SCP Global Technologies, a leading supplier of semiconductor cleanroom equipment, has entered into a joint development agreement with a Asian DRAM manufacturer.
SCP said it could not reveal the name of the manufacturer because the firm would not give SCP permission to release it.
The objective of the agreement, however, is to develop applications that overcome watermarks and other critical cleaning obstacles in wafer processing.
As part of the agreement, SCP has provided a prototype emersion single-wafer tool that has been installed in the customer’s facility in Korea.
“Numerous tests using customer wafers show that SCP emersion technology is capable of high cleaning efficiency without megasonics damage, and that it effectively dries sub-90nm philic /phobic high-aspect-ratio structures without watermarks or bridging,” said Eric Hansen, SCP vice president and CTO.