Toshiba unveils nine-layer stack

January 23, 2004 – Toshiba Corp. said it has developed a multi-chip package that can stack nine layers, with 70-micron chip thickness and an overall thickness of 1.4mm — the same as the company’s 6-layer, 85-micron chip stack.

The package uses a combination of memory chips (SRAM, SDRAM, NOR flash, NAND flash) with a capacity of 776Mb in a sample application.

Toshiba plans to launch the product in May 2004, for use in digital mobile equipment such as camera phones.


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