ChipPac completes qualification of single- and stacked-die CSPs and BGAs

(February 2, 2004) Fremont, Calif.&#8212ChipPac Inc. has completed customer qualification of single- and stacked-die CSPs and BGAs for 90-nm silicon technology with copper and two types of low-k dielectrics &#8212 including an inorganic and an organic dielectric from two foundries.

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