The new company expects to pull in more than US$1 billion in revenue in 2004. The company is expected to have leadership in mixed signal testing, and also will offer one of the broadest portfolios of assembly products and leadership in advanced packaging technologies such as stacked die, SiP and wafer-level packaging.
(February 10, 2004) Willow Grove, Penn.—Kulicke & Soffa Industries Inc. has sold all the assets associated with its advanced packaging technology segment, which consisted solely of the flip chip business. The assets were sold to FlipChip International LLC, for approximately $3.4 million and the assumption of certain liabilities.