Nanometrics, Lam ink metrology deal

February 17, 2004 – Nanometrics Inc., Milpitas, CA, has signed a deal to integrate its NanoOCD/DUV 9101b film thickness mapping module into Lam’s CMP tool, removing the need to move wafers to a standalone metrology tool. Lam has qualified the module for monitoring dielectric film thickness, erosion, and copper residue.


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