Semitool licenses IP to Applied

February 17, 2004 – Semitool Inc., Kalispell, MT, has licensed its IP for seed layer enhancement process to Applied Materials Inc., Santa Clara, CA, for use in Applied’s electroplating system.

The company has received an initial license fee, and is entitled to additional fees and royalties upon commercialization for the process, which is used for fabricating copper interconnects. The deal also ends a patent infringement suit brought by Semitool.


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