SEZ launches wafer-cleaning tools

February 9, 2004 – SEZ Group, Villach, Austria, has added three tools to its Da Vinci line of wafer-cleaning tools.

One of the tools is multi-changer systems that perform back-end-of-line (BEOL) etch residue polymer removal on 200mm and 300mm wafers.

The other two perform etch and clean, polymer, and other back- and front-side BEOL processes.


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