Siltronic, Soitec ink licensing deal

February 23, 2004 – Wacker Siltronic has signed a licensing deal for Soitec’s Smart Cut technology, which will allow it to produce SOI and strained-SOI wafers with a target customer-delivery date of 2005. The two also will accelerate development of strained-SOI wafers.

The deal maintains Soitec’s two-pronged strategy to generate revenues from IP licensing in addition to direct sales, according to president and CEO Andre Auberton-Herve.


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