(February 3, 2004) Munich, Germany&#8212Unitive has selected SUSS lithography equipment to develop next-generation packaging processes. The equipment installation and process development will take place at Unitive’s facility in Research Triangle Park, North Carolina.

Unitive provides wafer-level packaging for manufacturers of semiconductors, compound semiconductors and MEMS. Under the terms of the agreement, SUSS will help Unitive upgrade its installed base of SUSS 1X full-field lithography (1XFFL) systems with SupraYield technology. SUSS will also provide technical support.

“To keep pace with the increased requirements for more integration on chip, we recognized that we need to enhance our photolithography capabilities while maintaining our cost-effective processes,” explains Dan Mis, Unitive’s VP of Technology Integration. “We considered steppers, but decided on SUSS MicroTec’s SupraYield technology. By enhancing our existing SUSS full-field lithography systems, we can achieve high overlay accuracy and resolution of a stepper without spending additional time and resources bringing a stepper on line. This technology enhancement also allows us to maintain our high level of quality while decreasing our achievable dimensions.”