Winbond reading fab for 3Q

February 11, 2004 – Winbond Electronics Corp. said it is planning to start the $1.3 billion first stage of construction on its 300mm facility in the Central Taiwan Science Park by 3Q03, according to a story in the Taiwan Economic News.

Volume production of chips using 0.11-micron processes is scheduled for 2Q06, ramping up to capacity of 24,000 wafers/month by 2Q07.

The facility will focus on niche DRAM, flash memory, and MRAM chips, according to company president C.J. Chang.


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