Hymite raises $12 million for MEMS packaging

March 9, 2004 — Hymite A/S, a Denmark-based manufacturer of silicon-based hermetic packages for optoelectronic and MEMS components, announced it closed a second round of financing for $12 million.

Techno Venture Management (TVM) and InnovationsKapital led the round. Previous investors Vertex Venture Holdings, Dansk Kapitalanlaeg, Vaekstfonden and Olicom A/S also participated in the current round.

Niels-Kristian Hersoug, Hymite’s chief executive, said in a prepared statement that the company will use the funds and connections to continue rolling out its packaging technology.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.