Lattice to help fund Fujitsu’s 300mm fab

March 23, 2004 – Lattice Semiconductor Corp., Hillsboro, OR, and Fujitsu have signed a deal that will bring up to $200 million into Fujitsu’s planned $1.5 billion 300mm fab in Mie Prefecture.

Under the deal, Fujitsu will manufacture FPGAs using 130nm and 90nm CMOS processing technologies and jointly developed 130nm embedded Flash, and are discussing collaboration at 65nm. The first products are expected to be introduced in mid-2004, with volume shipments beginning by the end of the year.

Although Lattice has relationships with foundries in Taiwan and the US, “Fujitsu probably provides us the best technology, which is generally speaking not available in the open foundry market in Taiwan,” said Lattice chairman and CEO Cyrus Tsui.


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