New Products

Flip Chip Epoxy Fluxes

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The PK-001 and PK-002 flip chip epoxy fluxes were designed for use with Sn 62 and Sn 63 eutectic solders. PK-001 and PK-002 are fast curing, halide-free, no-clean fluxes that are suitable for flip chip or chip scale package soldering processes. The environmentally friendly fluxes have a stable thermoset residue that is compatible with standard underfill materials, conformal coatings, and most other coatings and finishes. Pin transfer, stencil printing, dispensing or dipping techniques can be used to apply the fluxes. Indium Corp., Utica, N.Y.,

SOC Test Solution

This company introduces a low-cost RF SOC test solution that tests, in quad-site, all devices in a wireless radio for wireless applications. The solution includes an RFIC IQ analog option for the performance necessary for high data rates demanded by emerging wireless standards. The RFIC IQ analog option provides a relative amplitude accuracy of ±0.05 dB and a relative phase accuracy of ±0.2°. With dual-core 14-bit waveform generators and dual-core 12-bit digitizers operating at 100 MSa/s, the option can source and measure IQ channels in parallel. The solution comes standard with the following components: 64 pins of 250 Mbps digital; 12 RF ports; 8GHz stimulus and measure; 40 MHz IF bandwidth; RFIC IQ analog option; and full suite of measurement capability. Agilent Technologies, Palo Alto, Calif.,

Microfocus X-ray

New features enhance the reliability, performance and implementation of Kevex PXS5-927, a 90-kV line of microfocus X-ray sources. The system integrates the complete X-ray source — tube, power supply and control unit — in one package. The system also provides good image resolution, high magnification, and strong focal spot location and X-ray flux stability. Thermo Electron Corp., Scotts Valley, Calif.,

Flash Microcontrollers

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This family of 8-bit Flash microcontrollers (MCU) features advanced motor control peripherals that extend the life of motors in automotive, industrial, appliance and consumer applications. The 40-pin PIC 18F4331/4431 and 28-pin 18F2331/2431 MCUs provide a solution for precise and energy-efficient operation through advanced analog and digital feedback, and the new three-phase complementary pulse width modulation (PWM) control system. The power control module has a three-phase PWM structure; the motion feedback module includes a quadrature encoder interface; and the third module consists of a high-speed analog-to-digital converter, which operates at 200 ksps and can be synchronized with the PWM. Microchip Technology Inc., Chandler, Ariz.,

Automated Programming System

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The 3600 is designed for medium- to high-volume production environments where speed and flexibility are critical. The system incorporates self-teaching and nonstop operation. The 3600 performs a continuity test on every pin before programming, which helps eliminate defective devices before programming starts. Its self-teaching function takes less than five minutes to setup a new job, and 95 percent of the electronics are contained in the e-box. BP Microsystems, Houston, Texas,

Vertical Carousels

The 2100-Series and 2200-Series medium-duty vertical carousels offer ergonomic design, security and safety features, and high-throughput reliability. They enable high-density, small-footprint storage-space utilization. The carousels come standard with various levels of control, and feature optional counter-mounted pick-to-light displays. Products are stored fully enclosed within the carousels. White Systems, an FKI Logistex Member Co., Kenilworth, N.J.,

Solder Replacement Adhesive

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A series of patented silver-filled organic adhesives, designated DM6030Hk, is available with thermal properties exceeding those of most common solders used to attach high-power devices. Thermal conductivities as high as 60 W/mK and electrical resistivities as low as 6 µmΩcm can be achieved, generating a thermal resistance equal to or better than Au/Sn solder in customer applications. Unlike solder attach, the pastes require no component plating, no flux or non-oxidizing atmosphere, have minimal voiding in the bondline, and feature a lead-free composition. Diemat Inc., Byfield, Mass.,

Stacked-die CSP

This company delivers a six stacked-die CSP in a thin, 1.6-mm profile. The 17 x 17-mm, dime-sized package with more than 400 leads houses a DSP or an applications ASIC chip, along with flash and SDRAM chips for compact footprint products such as cell phones, PDAs and digital camera applications. Functional integration includes a high pin count DSP for the base band or ASIC for the applications. The low-profile package is enabled by the 75-µm-thick die and two spacers that allow placement of a large die on top of a smaller die, low 65-µm loop height of wire bonding and the film-die-attach technology that enables an even thinner, 1.4-mm profile. ChipPAC Inc., Fremont, Calif.,

Software Upgrade

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This company released Version 4.7 of its Fluidmove for Windows NT dispensing software. Designed for the Millennium and Axiom dispensing platforms, the software now features Delta Z dispensing. By measuring the surface height in multiple locations along the programmed pattern before dispensing a continuous path, the system ensures a consistent dispense gap on uneven surfaces and more precise dot and line dimensions. Delta Z is for close dispensing tolerance in applications such as wafer-level packages and optical display components. In addition to the ability to dispense fluid along XYZ paths, FmNT 4.7 integrates the company's calibrated process jetting system with its high-speed DispenseJet technology. Asymtek, Carlsbad, Calif.,

Fine-pitch Bondtester

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Designed to meet the demands of testing ultra-fine-pitch wire bonded devices, the Series-5000 Bondtester is capable of testing bonds at 50-µm pitches and below. The tester includes leading-edge optical systems help operators align and grade bonds, and low-force transducer systems and shear-and-pull tooling to minimize lead and ball damage. Additional features include easily adjustable optics mounting, low-force/high-resolution loadcartridges, “quick guard” loadtools, borescope image system, high-precision X/Y sample manipulation; antivibration mount and cavity shear. Dage Precision Industries, Fremont, Calif.,

Mass Imaging Process

To improve the uniformity of thermal interface material (TIM), mass imaging techniques have been deposited between a silicon die and its package lid during semiconductor packaging processes. By mass imaging the material, users can be certain that the die surface is covered by a uniform thickness. Advantages of the process include better thermal connectivity between the die and the lid, which improves reliability, as well as greater lid coplanarity. Mass imaging allows the shape of the thermal material deposit to be controlled accurately and repeatably. The thickness of the initial deposit is uniform across the die surface. DEK International GmbH, Flemington, N.J.,

Semiconductor Characterization Software

The Model 4200-SCS semiconductor characterization system was introduced with the company's KTEI v5.0 software. This combination provides users with a standard test system for running not only semiconductor characterization tests, but also stress-measure and reliability tests for device lifetime analysis and quality assurance. Running in either Windows NT or XP environments, the software provides advanced test definition, parameter analysis, graphing and automation capabilities required for modern semiconductor characterization and reliability testing. In addition to core performance enhancements, the software incorporates stress-measure capabilities to enable a variety of reliability tests. Keithley Instruments Inc., Cleveland, Ohio,


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