Quicker high level chip design

The design gap
The complexity of recently available products, such as new 3G mobile phones, camera and PDA combos, is staggering and requires a huge design effort. “There is no doubt that electronic systems of the future are going to be very complex,” says Frank Oppenheimer of the OFFIS Research Institute, Oldenburg, and coordinator of the IST project ODETTE. “The complexity has been on the increase for a decade or so and we expect the trend to continue for the next 10-15 years.”

(March 25, 2004) Danbury, Conn.&#8212ATMI Inc., a supplier of materials and materials packaging to semiconductor manufacturers, has entered into a definitive agreement to sell its gallium nitride substrates and epitaxy business to Cree Inc. of Durham, North Carolina, subject to customary closing conditions and certain third party approvals.


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