“For more than a decade now, with the exception of the boom year 2000, sales have been slightly lower in January than December because of the seasonality of the semiconductor industry,” says SIA president George Scalise. “We continue to expect sales for all of 2004 to meet the current forecast of 19.4 percent, with broad-based strength in all major end-markets&#8212especially computation, communications, global consumer and automotive,” Scalise adds.

(March 05, 2004) San Jose, Calif.&#8212A joint venture between California-based Integrated Packaging Assembly Corp. (IPAC) and Twin Advance of Penang, Malaysia is launching a new company called IPAC Twin Advance that will offer advanced module and system-in-package (SiP) development and manufacturing services.