Taiwan institute selects SUSS tools

March 18, 2004 — Taiwan’s Industrial Technology Research Institute (ITRI) has selected SUSS MicroTec AG’s (News, Web) wafer and direct bonding equipment for expanding its MEMS and nanoscale activities, according to a news release.

The nonprofit research and development organization has ordered several tools, including a combined cleaner and aligned direct bonder, a nanoPREP low-temperature plasma activation unit and an 8-inch wafer bonder. Such tools are used to create new substrate materials for wafer-level, 3-D packaging and encapsulation of MEMS, the release said.

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