Toshiba’s newest fab gears up for SoC LSI production this fall

In addition to 300-mm wafers, the new fab is expected to deploy 65-nm process and design technologies. A little further down the road, Toshiba says it also expects the fab to lead the industry in introducing 45-nm process technology and applying it to SoC devices.

(March 01, 2004) Phoenix, Ariz.&#8212A new study from Semico Research, ‘Wafer Demand 2004-2008: Wafers Growing But Will Profits?,’ addresses the key questions of will there be enough capacity to fulfill the growth in demand next year, and can we make enough profit during this upswing to carry us through the next downturn?

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